Starview S-LEDCOB-ID Series
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MicroLED COB Technology
Flip-chip COB packaging delivers a seamless coated surface that is more homogeneous than traditional SMD, offers extremely wide viewing angles and high contrast, and automatically protects the LEDs from external influences.
• Indoor 0.7, 0.9, 1.2, 1.5, 1.8mm Pixel Pitch
• Flip-Chip COB Technology
• Front Installation & Service
• Die Casting Aluminium
Technical specifications
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LED Type
Flip Chip COB
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Surface Treatment
Matt COB
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Surface Hardness
4H
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Cabinet Size (W x H x D, mm)
600 x 337.5 x 35.5 (Customize), 16:9
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Cabinet Weight
4 kg
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Cabinet Material
Die-casting Aluminium
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Brightness
600 nits
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Display Color
16 bit
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Brightness Uniformity (corrected)
≥ 99%
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Chromaticity Uniformity (corrected)
± 0.001
UAV
Drone
Solution
